Chia seed composition

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United States of America Patent

PATENT NO 9131726
APP PUB NO 20140087050A1
SERIAL NO

14094867

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Abstract

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A composition of matter is disclosed and formed from a stable, defatted whole grain flour derived from Salvia hispanica L. whole ground seed using a suitable solvent that is free of cyanogenic glycosides, vitamin antagonists, and gluten. The composition includes minerals, about 30% wt/wt protein, about 30-40% insoluble fiber and about 2-3% of fructo-oligosaccarides.

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Patent Owner(s)

Patent OwnerAddress
U S NUTRACEUTICALS LLCEUSTIS FL

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hill, W Stephen Ocala, US 82 774
Minatelli, John A Mount Dora, US 82 807
Moerck, Rudi E Sanford, US 83 750
Nguyen, Uy Eustis, US 22 324

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