Buffer layer for sintering
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United States of America Patent
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Sep 8, 2015
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N/A
app pub date -
Nov 7, 2013
filing date -
Mar 27, 2009
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Abstract
A layer of material having a low thermal conductivity is coated over a substrate. A film of conductive ink is then coated over the layer of material having the low thermal conductivity, and then sintered. The film of conductive ink does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.
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