Method and apparatus for plating solution analysis and control
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United States of America Patent
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Sep 8, 2015
Grant Date -
Jun 18, 2009
app pub date -
Dec 12, 2008
filing date -
Dec 12, 2007
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Abstract
A plating system comprises a plating solution and an apparatus for control of the plating solution, the apparatus including a Raman spectrometer for measurement of organic components, a visible light spectrometer for measurement of metallic components, and a pH probe. The plating solution can be sampled continuously or at intervals. Dosing of the plating solution adjusts for components consumed or lost in the plating process. The method of dosing is based on maintaining a desired composition of the plating solution.
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