Method for a fluid-tight connection of two components for producing a fluid-tight cooling unit
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United States of America Patent
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Sep 8, 2015
Grant Date -
Jul 12, 2012
app pub date -
Jan 9, 2012
filing date -
Jul 7, 2009
priority date (Note) -
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Abstract
A method for connecting two components in a fluid-tight manner for producing a fluid-tight unit is provided. The method includes a step of providing at least one first component that is solder-plated on one side, wherein the first component has a cutting burr on a side facing away from the solder-plated surface. The method further includes a step of connecting, in particular soldering, the first component to a second component in a fluid-tight manner, in order to produce the fluid-tight unit, wherein the solder-plated surface of the first component faces the second component when connecting the first and second components in a fluid-tight manner.
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