Method of manufacturing passive component module
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United States of America Patent
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Sep 1, 2015
Grant Date -
May 16, 2013
app pub date -
Nov 16, 2011
filing date -
Nov 16, 2011
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Abstract
A method of manufacturing a passive component module includes the steps of: bonding passive components to a carrier, wherein each of the passive components has interconnection pads; forming a dielectric molding material over the carrier, so that the passive components are embedded in the molding material; separating the molding material, which has the passive components embedded therein, from the carrier; exposing all interconnection pads of the passive components; and building electrical interconnections between the passive components to obtain the passive component module. The steps of bonding, forming, separating, exposing and building are performed in the recited order.
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