Wireless IC device
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United States of America Patent
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Sep 1, 2015
Grant Date -
Nov 17, 2011
app pub date -
Apr 18, 2011
filing date -
May 14, 2010
priority date (Note) -
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Abstract
A wireless IC device includes a substantially rectangular parallelepiped dielectric body, a metal pattern that is provided on the surface of the dielectric body via a film and functions as a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. The dielectric body has a laminated structure including a folded flexible dielectric layer. Surfaces of the dielectric layer which face each other after the dielectric layer has been folded are non-bonded surfaces.
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