Dicing die bond film

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9123794
APP PUB NO 20140057100A1
SERIAL NO

14072684

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a dicing die bond film in which peeling electrification hardly occurs and which has good tackiness and workability. The dicing die bond film of the present invention is a dicing die bond film including a dicing film and a thermosetting type die bond film provided thereon, wherein the thermosetting type die bond film contains conductive particles, the volume resistivity of the thermosetting type die bond film is 1×10−6 Ω·cm or more and 1×10−3 Ω·cm or less, and the tensile storage modulus of the thermosetting type die bond film at −20° C. before thermal curing is 0.1 to 10 GPa.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATION1-1-2 SHIMOHOZUMI IBARAKI-SHI OSAKA 5678680 ?5678680

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Amano, Yasuhiro Ibaraki, JP 22 113
Kimura, Yuta Ibaraki, JP 37 348
Morita, Miki Ibaraki, JP 10 108

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