Bonding alignment tool and method
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United States of America Patent
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Sep 1, 2015
Grant Date -
Apr 11, 2013
app pub date -
Oct 6, 2011
filing date -
Oct 6, 2011
priority date (Note) -
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Abstract
An apparatus is disclosed for detecting flag velocity during a eutectic process for bonding two wafers. The apparatus includes a plurality of sensors for detecting a time and/or velocity of a plurality of flags within a flag-out mechanism. The apparatus also includes one or more displays displaying time durations associated with the movement of the flags during the bonding process. Also disclosed is a method of aligning wafers in a eutectic bonding process. The method includes determining one or more time durations associated with the movement of the flags in the plurality of flags. The method also includes determining if a misalignment has occurred based on the one or more time durations associated with the movement of the flags.
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