Chip to dielectric waveguide interface for sub-millimeter wave communications link

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United States of America Patent

PATENT NO 9123737
APP PUB NO 20120068891A1
SERIAL NO

12887323

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Abstract

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In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.

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Patent Owner(s)

Patent OwnerAddress
TEXAS INSTRUMENTS INCORPORATED12500 TI BOULEVARD M/S 3999 DALLAS TX 75243

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akhtar, Siraj Richardson, US 40 196
Corsi, Marco Parker, US 112 2648
Haroun, Baher S Allen, US 132 1543
Warke, Nirmal C Irving, US 56 482

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