Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

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United States of America Patent

PATENT NO 9123734
APP PUB NO 20140206148A1
SERIAL NO

14168628

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Abstract

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The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATION13-9 SHIBA DAIMON 1-CHOME MINATO-KU TOKYO 105-8518

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Enomoto, Tetsuya Ibaraki, JP 42 328
Honda, Kazutaka Ibaraki, JP 38 162
Nakamura, Yuuki Ibaraki, JP 73 790

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