Method of sealing a glass envelope
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 1, 2015
Grant Date -
Sep 3, 2009
app pub date -
Feb 26, 2009
filing date -
Feb 28, 2008
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method of hermetically sealing a glass assembly comprising glass plates or substrates with a glass-based frit when there is a large difference between the coefficient of thermal expansion (CTEs) of the frit and the CTEs of the glass plates. The method comprises a rapid increase of an irradiating heat source, used to heat and soften the frit, from a non-sealing power to a sealing power over a very short distance along the frit to form an initial stabilizing seal between the substrates.
First Claim
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
CORNING INCORPORATED | ONE RIVERFRONT PLAZA CORNING NY 14831 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Gu, Yabei | Painted Post, US | 13 | 115 |
# of filed Patents : 13 Total Citations : 115 | |||
Russell, Andrew Lawrence | Elmira, US | 1 | 22 |
# of filed Patents : 1 Total Citations : 22 | |||
Zhang, Lu | Painted Post, US | 400 | 2978 |
# of filed Patents : 400 Total Citations : 2978 |
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Patent Citation Ranking
- 4 Citation Count
- H01L Class
- 10.46 % this patent is cited more than
- 10 Age
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