Chemical mechanical polishing slurry compositions and polishing method using the same
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United States of America Patent
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Sep 1, 2015
Grant Date -
Nov 8, 2012
app pub date -
Jun 27, 2012
filing date -
Dec 31, 2009
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Abstract
Disclosed herein is a CMP slurry composition. The CMP slurry composition includes cerium oxide particles, an adsorbent for adsorbing the cerium oxide particles to a polishing pad, an adsorption adjusting agent for adjusting adsorption performance of the adsorbent, and a pH adjusting agent. The CMP slurry composition may improve polishing efficiency of a patterned oxide layer and lifespan of a diamond disc conditioner.
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