Integrated circuit apparatus, three-dimensional integrated circuit, three-dimensional processor device, and process scheduler, with configuration taking account of heat
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United States of America Patent
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Sep 1, 2015
Grant Date -
Feb 27, 2014
app pub date -
Oct 22, 2012
filing date -
Dec 1, 2011
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Abstract
The present invention provides a three-dimensional integrated circuit wherein generation of hot spot which makes a high temperature part as a result of intensively generated heat can be suppressed in. The integrated circuit apparatus comprises: a first circuit made of a memory circuit, a second circuit made of an arithmetic circuit, and a control circuit. The first circuit is partitioned into a plurality of circuit blocks according to the distance from the arranged position of the second circuit, and the control circuit controls the partitioned respective circuit blocks separately.
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