Pattern forming process

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United States of America Patent

PATENT NO 9122147
APP PUB NO 20140235057A1
SERIAL NO

14156538

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Abstract

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A pattern is formed by coating a resist composition comprising a resin comprising recurring units having an acid labile group, a photoacid generator, and a first organic solvent onto a processable substrate, prebaking, exposing, PEB, and developing in an organic solvent developer to form a negative pattern; heating the negative pattern to render it resistant to a second organic solvent; coating a solution of a resin having a carbon content of at least 75 wt % in the second organic solvent thereon, prebaking, and dry etching to effect image reversal for converting the negative pattern into a positive pattern.

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Patent Owner(s)

Patent OwnerAddress
SHIN-ETSU CHEMICAL CO LTDTOKYO 1000005

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hatakeyama, Jun Joetsu, JP 692 7607
Ogihara, Tsutomu Joetsu, JP 204 2124

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