Method of fabricating a wafer level optical lens assembly
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United States of America Patent
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Sep 1, 2015
Grant Date -
Jun 18, 2015
app pub date -
Dec 17, 2013
filing date -
Dec 17, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates to method of fabricating a wafer level optical lens substrate. The method comprising providing a first wafer substrate having a plurality of bumps, applying a first polymer liquid on a first contact optical surface of said plurality of bumps, providing a second wafer substrate, and contacting said first wafer substrate with said second substrate in such that said first polymer liquid is located in a slit created between said first contact optical surface of said plurality of bumps and said second wafer substrate under capillary forces. The method comprises thereafter curing said polymer liquid(s) to form a lens.
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International Classification(s)
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B29D:PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FRO....
- G02B:OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- B29K:INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, ....
- B29L:INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RE....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
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