Probe assembly, probe card including the same, and methods for manufacturing these
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United States of America Patent
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Sep 1, 2015
Grant Date -
Jun 20, 2013
app pub date -
Dec 18, 2012
filing date -
Dec 20, 2011
priority date (Note) -
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Abstract
Quality of connection portions between respective probes and respective wires in a probe assembly is improved. Also, time required for work for connection between the probes and the wires is shortened. Further, improper connection between the probes and the wires is eliminated. A probe assembly includes an electric insulating substrate, a plurality of probes supported on one surface of the substrate, a plurality of through holes provided in the substrate to respectively correspond to the plurality of probes and filled with a conductive material attached to the respective probes, and a plurality of conductive membranes formed on the other surface of the substrate and respectively attached to the conductive material in the plurality of through holes.
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