Surface acoustic wave monitor for deposition and analysis of ultra-thin films

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United States of America Patent

PATENT NO 9121754
APP PUB NO 20140007692A1
SERIAL NO

13485317

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Abstract

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A surface acoustic wave (SAW) based thin film deposition monitor device and system for monitoring the deposition of ultra-thin films and nanomaterials and the analysis thereof is characterized by acoustic wave device embodiments that include differential delay line device designs, and which can optionally have integral reference devices fabricated on the same substrate as the sensing device, or on a separate device in thermal contact with the film monitoring/analysis device, in order to provide inherently temperature compensated measurements. These deposition monitor and analysis devices can include inherent temperature compensation, higher sensitivity to surface interactions than quartz crystal microbalance (QCM) devices, and the ability to operate at extreme temperatures.

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Patent Owner(s)

Patent OwnerAddress
SENSANNA INCORPORATED7468 CANDLEWOOD RD SUITE A HANOVER MD 20176

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hines, Jacqueline H Arnold, US 16 140

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  • 4 Citation Count
  • C23C Class
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