Surface acoustic wave monitor for deposition and analysis of ultra-thin films
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United States of America Patent
Stats
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Sep 1, 2015
Grant Date -
Jan 9, 2014
app pub date -
May 31, 2012
filing date -
Jul 28, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A surface acoustic wave (SAW) based thin film deposition monitor device and system for monitoring the deposition of ultra-thin films and nanomaterials and the analysis thereof is characterized by acoustic wave device embodiments that include differential delay line device designs, and which can optionally have integral reference devices fabricated on the same substrate as the sensing device, or on a separate device in thermal contact with the film monitoring/analysis device, in order to provide inherently temperature compensated measurements. These deposition monitor and analysis devices can include inherent temperature compensation, higher sensitivity to surface interactions than quartz crystal microbalance (QCM) devices, and the ability to operate at extreme temperatures.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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SENSANNA INCORPORATED | 7468 CANDLEWOOD RD SUITE A HANOVER MD 20176 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Hines, Jacqueline H | Arnold, US | 16 | 140 |
# of filed Patents : 16 Total Citations : 140 |
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- 4 Citation Count
- C23C Class
- 13.95 % this patent is cited more than
- 10 Age
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 1, 2027 |
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