Plating apparatus
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United States of America Patent
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Sep 1, 2015
Grant Date -
Dec 26, 2013
app pub date -
Jun 26, 2012
filing date -
Jun 26, 2012
priority date (Note) -
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Abstract
A plating assembly for plating a part having an interior cavity with a plating material. The plating assembly has a main frame assembly adapted to receive and support the part. An anode frame assembly is positioned inside the main frame assembly and is electrically isolated from the main frame assembly. The anode frame assembly is electrically connected to an anode of a direct current power supply. A plurality of anode rods are mounted on the anode frame assembly in electrically conductive contact with it. A cathode assembly is electrically connected to the part and is electrically connected to a cathode of the direct current power supply. A fluid conduit assembly connects a fluid source such as a pump station to a plurality of fluid nozzles. At least one of the fluid nozzles is positioned within the interior cavity of the part.
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