Sputtering method and sputtering apparatus
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United States of America Patent
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Sep 1, 2015
Grant Date -
Sep 25, 2008
app pub date -
Feb 22, 2008
filing date -
Feb 26, 2007
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Abstract
The objective of the present invention is to provide a technique capable of easily forming an alloy layer containing an additive metal on an object to provide a concentration gradient in a thickness direction by sputtering in one treatment vessel. That is, the present invention can form a film with the desired concentration, and includes a first film forming process and a second film forming process that changes at least one of, the pressure in the treatment vessel, and the electric power so they are different from the first film forming process, so that the concentration of the additive metal is different from the concentration of the additive metal of the first alloy film.
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