Copper alloy sheet and method for manufacturing copper alloy sheet
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United States of America Patent
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Sep 1, 2015
Grant Date -
Jul 24, 2014
app pub date -
Jan 24, 2014
filing date -
Sep 16, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfies a relationship of 20≦[Zn]+7×[Sn]+15×[P]+4.5×[Ni]≦32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 μm to 5.0 μm, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70 % or more.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MITSUBISHI SHINDOH CO LTD | TOKYO TOKYO METROPOLIS |
International Classification(s)

- 2014 Application Filing Year
- H01B Class
- 1335 Applications Filed
- 1040 Patents Issued To-Date
- 77.91 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Oishi, Keiichiro | Osaka, JP | 78 | 383 |
# of filed Patents : 78 Total Citations : 383 | |||
Suzaki, Kouichi | Osaka, JP | 18 | 24 |
# of filed Patents : 18 Total Citations : 24 |
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- 0 Citation Count
- H01B Class
- 0 % this patent is cited more than
- 10 Age
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