Device for encapsulating a component with plastics material
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United States of America Patent
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Sep 1, 2015
Grant Date -
Apr 3, 2014
app pub date -
May 24, 2012
filing date -
May 31, 2011
priority date (Note) -
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Abstract
The invention relates to a device (10; 10a) for encapsulating a component (1) with plastic material (2), comprising at least two tool parts (11, 12), which in a closed arrangement for encapsulating the component (1) form a receptacle (15) for the component (1), an injection channel (30) for supplying the liquefied plastic material (2) to the region of the receptacle (15), and a single retaining element (22) for positioning the component (1) in the receptacle (15), wherein the retaining element (22) can be moved in a first position for positioning the component (1) in the receptacle (15) and in a second position for preferably completely encapsulating the component (1) with the plastic material (2). According to the invention, the retaining element (22) holds the component (1) in the region of the receptacle (15) by means of form positive and/or clamping engagement.
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