Multi-step cutting process

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United States of America Patent

PATENT NO 9120179
SERIAL NO

13623595

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Abstract

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Methods related to efficient processing of sapphire are discussed which are expected to both speed manufacture of corundum for applications and make the use of conundrum cost effective. In particular, one embodiment may take the form of a method of cutting a hard transparent material having a polished surface. The method includes roughening the polished surface, directing a laser beam at the hard transparent material to melt the material and removing the melted hard material.

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Patent Owner(s)

Patent OwnerAddress
APPLE INCONE APPLE PARK WAY CUPERTINO CA 95014

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Memering, Dale N San Francisco, US 97 1395
Richter, Anthony J San Jose, US 5 25
Yan, Vincent San Francisco, US 10 147

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