Method of radiatively grooving a semiconductor substrate
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United States of America Patent
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Sep 1, 2015
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Jan 27, 2014
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Jan 28, 2013
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Abstract
A method of radiatively scribing a substantially planar semiconductor substrate using a laser scribing apparatus, uses a laser scribing head configured and arranged to produce a two-dimensional array of laser beam spots to effect the scribing. In an embodiment, the spots of the array extend substantially parallel to X and Y directions in the plane of the substrate. In an embodiment, spots at a periphery in one or both directions of the array have a lower intensity than laser beams in a central portion of the array.
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