Electronic component element housing package
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United States of America Patent
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Aug 25, 2015
Grant Date -
Sep 19, 2013
app pub date -
May 1, 2013
filing date -
Nov 1, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component element housing package is produced by firing a ceramic substrate for housing an electronic component element and a metal layer for bonding to the ceramic substrate to form an electrical path, simultaneously in a reducing atmosphere. The ceramic substrate comprises alumina (Al2O3), a partially stabilized zirconia by forming solid solution with yttria (Y2O3) and a sintering agent. The sintering agent comprises magnesia (MgO), and at least 1 type selected from silica (SiO2), calcia (CaO), or manganese oxides (MnO, MnO2, Mn2O3, Mn3O4).
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C04B:LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREO....
- B22F:WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES F....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- C22C:ALLOYS
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