Attachment of wafer level optics
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United States of America Patent
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Aug 25, 2015
Grant Date -
Aug 27, 2009
app pub date -
Feb 10, 2009
filing date -
Feb 22, 2008
priority date (Note) -
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Abstract
A technique for assembling camera modules that includes attaching optical elements, such as an optics stack, directly to the upper surface of an image sensor. A housing may be provided to partially surrounded the optics stack. Alternatively, the housing can be provided by a transfer molding process. This technique can be applied in array processing scenario and solder balls can be attached to the bottom of the image sensor to provide an efficiently-produced and low cost camera module.
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