High frequency module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 25, 2015
Grant Date -
Feb 26, 2015
app pub date -
Oct 30, 2014
filing date -
May 2, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A multilayered high frequency module includes inductor conductor patterns each defined by a linear conductor having a coiled shape on intermediate insulator layers of a multilayer body. A first spiral inductor with its axis extending in the stacking direction is defined by the inductor conductor patterns on respective layers connected through conductive via holes. Overlapped portions of inner regions of the individual inductor conductor patterns within the coiled shape define an air core portion of the first inductor. A capacitor conductor pattern is provided on one layer lower than the insulator layers on which the inductor conductor patterns are provided. The capacitor conductor pattern is a flat plate and located at a position not overlapping with the air core portion when looking at the multilayer body in a plan view.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully