Balun circuit using a defected ground structure
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United States of America Patent
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Aug 25, 2015
Grant Date -
Nov 6, 2014
app pub date -
Dec 7, 2012
filing date -
Dec 26, 2011
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Abstract
Disclosed is a balun circuit using defected ground structure. The balun circuit using a defected ground structure includes: a substrate; a ground surface formed on one surface of the substrate, the ground surface being formed with defect structure in a previously set shape; and two transmission lines formed on the other surface of the substrate opposing the ground surface, and separated from each other, and the defect structure of the ground surface is configured to have open circuit impedance characteristics, and one of the two transmission lines is grounded. An even mode signal is removed by using the defect ground structure having the open circuit impedance characteristics, and termination of total reflection characteristics is performed by using the grounding of one of the transmission lines. Accordingly, a balun circuit can be obtained which is small in size, has little loss at high frequency, and shows little change in characteristics due to the process error.
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