Use of flexible circuits incorporating a heat spreading layer and the rigidizing specific areas within such a construction by creating stiffening structures within said circuits by either folding, bending, forming or combinations thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 25, 2015
Grant Date -
N/A
app pub date -
Feb 8, 2013
filing date -
Feb 10, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of and the device for making a LED assembly that contains regionally rigid structures that are made by bending, folding, or forming a flexible hybrid heat spreading laminate is provided. The hybrid heat spreading laminate comprises a thin heat spreader layer in the range of 100-150 micrometers. The hybrid heat spreading laminate has enhanced heat conductivity and thermal emissivity.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully