Heat sink device and method of repairing semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 25, 2015
Issued Date -
N/A
app pub date -
Jul 18, 2011
filing date -
Jul 28, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully