Method and system for energized and pressurized liquids for cleaning/etching applications in semiconductor manufacturing
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United States of America Patent
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Aug 25, 2015
Grant Date -
Jul 31, 2014
app pub date -
Jan 30, 2013
filing date -
Jan 30, 2013
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Abstract
A wet chemical processing method and apparatus for use in semiconductor manufacturing and in other applications, is provided. The method and apparatus provide for energizing a processing liquid such as a cleaning or etching liquid using ultrasonic, megasonic or other energy waves or by combining the liquid with a pressurized gas to form a pressurized spray, or using both. The energized, pressurized fluid is directed to a substrate surface using a fluid delivery system and overcomes any surface tensions associated with liquids, solids, or air and enables the processing liquid to completely fill any holes such as contact holes, via holes or trenches, formed on the semiconductor substrate.
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