Light emitting diode package structure
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United States of America Patent
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Aug 25, 2015
Grant Date -
Apr 2, 2015
app pub date -
Jun 16, 2014
filing date -
Oct 1, 2013
priority date (Note) -
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Abstract
A light emitting diode package structure is provided. The light emitting diode package structure includes at least one light emitting diode unit, an encapsulating body and at least one isolation film. The encapsulating body includes a plurality of surfaces and at least one light-emitting surface, wherein one of the surfaces supports the light emitting diode unit, the other surfaces are exposed. The at least one isolation film is formed on the exposed surfaces. Wherein the isolation film blocks or reflects a portion of light emitted from the light emitting diode unit.
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