Reduced thickness and reduced footprint semiconductor packaging
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United States of America Patent
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Aug 25, 2015
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N/A
app pub date -
Mar 20, 2014
filing date -
Mar 20, 2014
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Abstract
Semiconductor devices and methods for forming semiconductor devices are presented. A device formed of a semiconductor material is configured to mount upon a substrate layer surface having a substrate layer wire attach pad. The device includes a top planar surface with an electrically active region, and a bottom planar surface disposed substantially parallel to the top planar surface. A shelf region is disposed between the top planar surface and the bottom planar surface, and a device wire attach pad in electrical communication with the active region is located on the shelf region.
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