High temperature-resistant, electrically conductive thin films
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United States of America Patent
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Aug 25, 2015
Grant Date -
Feb 7, 2013
app pub date -
Mar 10, 2011
filing date -
Mar 29, 2010
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Abstract
Electrically conductive thin film metallizations having continuous operating temperatures of 300° C. and more are of considerable practical interest for a number of technical applications, such as surface wave elements. Technical reasons and high production costs are a bar to the use of standard films. In order to remedy this, films including a mixture of a high-melting conductive metal and aluminum oxides, wherein in particular aluminum-rich non-stoichiometric aluminum oxides are used. The aluminum oxides act as components thermally stabilizing the conductive metal film; an optional proportion of chemically available aluminum can additionally alloy with the conductive metal and thereby enables essential film properties, such as the electrical conductivity to be specifically influenced. It is thus possible, using standard materials and methods of thin film deposition, in a cost-effective manner to produce highly electrically conductive, thermally resistant films having good structurability and comparatively low density for a wide range of different applications.
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