Heat dissipation in computing device
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United States of America Patent
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Aug 25, 2015
Issued Date -
N/A
app pub date -
Oct 16, 2013
filing date -
Apr 24, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- G06F:ELECTRIC DIGITAL DATA PROCESSING
- F28D:HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTH....
- G11B:INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BET....
- F28F:DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATU....
- G02F:DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF ....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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