Device for embossing of substrates

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9116424
APP PUB NO 20110045185A1
SERIAL NO

12858509

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Abstract

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The invention relates to a device for embossing of substrates, especially semiconductor substrates or wafers, comprised of:

    at least one receiving means for holding the substrate in a working space,a calibration means located at least partially in the working space for calibration of the substrate,an embossing means which is located at least partially in the working space for embossing of the structure material onto the substrate in an embossing process, the working space being exposed to a defined atmosphere before and during the embossing process without interruption, and a method for embossing of substrates.

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Patent Owner(s)

Patent OwnerAddress
EV GROUP E THALLNER GMBH4782 ST FLORIAN AM INN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Glinsner, Thomas St. Florian am Inn, AT 12 21
Lindner, Friedrich Paul Schärding, AT 45 91
Wimplinger, Markus Ried im Innkreis, AT 79 805

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