Microelectromechanical system package and method of testing
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United States of America Patent
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Aug 25, 2015
Grant Date -
Oct 3, 2013
app pub date -
Mar 27, 2012
filing date -
Mar 27, 2012
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Abstract
A microelectromechanical system (MEMS) package is disclosed herein. The MEMS package includes a movable mass. The MEMS package further includes a first and second sense electrodes spaced apart from the movable mass. The first and second sense electrodes are configured to be electrically coupled with a controller. The MEMS package further includes a first test electrode and a second test electrode spaced apart from the movable mass. The first and the second test electrodes are configured to be electrically connected to first and second external electrical connectors, respectively. The first and second test electrodes are biased at a first voltage and a second voltage, respectively, when the first and second external electrical connectors are connected to external voltage sources.
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