Flexible IC/microfluidic integration and packaging
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United States of America Patent
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Aug 25, 2015
Grant Date -
Sep 19, 2013
app pub date -
Dec 14, 2012
filing date -
Dec 14, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A flexible IC/microfluidic hybrid integration and packaging method and resulting device. A single flexible elastomer substrate, such as polydimethylsiloxane (PDMS), has dedicated microchannels filled with liquid metals (or low melting point solders) to provide electrical interconnects to a solid-state IC die, such as CMOS, and additional microchannels for hybrid integration with microfluidics without performing any post-processing on the IC die. The liquid metal used can be a gallium-indium-tin eutectic alloy (also called Galinstan).
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- H01K:ELECTRIC INCANDESCENT LAMPS
- B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
- B01L:CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENE....
- G01N:INVESTIGATING OR ANALYSING MATERIALS BY DETERMININ....
- H01R:ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL AS....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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