Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards
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United States of America Patent
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Aug 25, 2015
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Apr 18, 2013
app pub date -
Oct 18, 2011
filing date -
Oct 18, 2011
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Abstract
The present invention relates to a manufacturing method for a fine grain surface copper foil with the low roughness, high peeling strength, high chemical resistance, high heat resistance, high resistance to moisture absorption and good etching properties, and applicable to all kinds of printed circuit boards. The technical characteristics are that the adhesion surface of copper foil is electroplated in an electroplating bath composed of copper sulfate, sulfuric acid, tungsten compounds to obtain a roughening treatment layer which is then treated with a electroplating copper foil method for anti-rust and thermoresistance known to the art to get a Zn alloy thermoresistant layer.
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