Method for reducing stress in three dimensional model

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United States of America Patent

PATENT NO 9114571
APP PUB NO 20130119577A1
SERIAL NO

13661287

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Abstract

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An apparatus and method of fabricating a three-dimensional model which reduces occurrence of one a hairline crack(s), stress fracture(s), break(s), flaw(s) and/or other imperfection(s) in the final three-dimensional model. The method comprising the steps of selecting the model material, selecting the sacrificial material, and adding at least one additive to the sacrificial material for at least one of increasing the thermal conductivity, decreasing a coefficient of thermal expansion or decreasing an ability of the sacrificial material to transmit stress to the model material. The three-dimensional composite model is built by depositing a plurality of layers one on top of another. Following completion of the three-dimensional composite model, using at least one of the increase in the thermal conductivity, the decrease in the coefficient of thermal expansion and the decrease in the ability of the composite sacrificial material to transmit stress to the model material for removing the composite sacrificial material from the model material without creating any hairline crack(s), stress fracture(s), break(s), flaw(s) and/or other imperfection(s) in the final three-dimensional model.

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Patent Owner(s)

Patent OwnerAddress
SOLIDSCAPE INC316 DANIEL WEBSTER HIGHWAY MERRIMACK NH 03054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gingras, Jennifer Elizabeth Epping, US 1 12
Wigand, John T Nashua, US 4 57
Winey, Calvin McCoy Peterborough, US 2 40
You, Xiaorong Shrewsbury, US 29 302

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