Assembly structure of power amplifier
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United States of America Patent
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Aug 18, 2015
Grant Date -
Feb 19, 2015
app pub date -
Apr 6, 2012
filing date -
Feb 21, 2012
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Abstract
An assembly structure of a power amplifier is provided. The assembly structure comprises at least two power amplifier modules, each power amplifier module comprises a heat-conducting board, an amplifier tube matching circuit board is assembled on the heat-conducting board; at least one radio frequency power amplifier tube is assembled on the amplifier tube matching circuit board, assembly directions of all the radio frequency power amplifier tubes are parallel to each other; the heat-conducting boards of adjacent two power amplifier modules are connected vertically along a transmission direction of the radio frequency signal. Comparing with the existing plane assembly technology, the application has a character of needing small assembly areas, which is adapted in an assembly environment with a certain height and small assembly areas.
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