Optically efficient solid-state lighting device packaging
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United States of America Patent
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Aug 18, 2015
Grant Date -
Oct 10, 2013
app pub date -
Apr 4, 2013
filing date -
Apr 4, 2012
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Abstract
Methods, systems, and devices are disclosed for light-emitting diode and laser diode packaging designs. In one aspect, an LED lighting device includes a substrate capable of dissipating heat, the substrate formed of a metal or ceramic material, an array of LED dies located on the substrate, electrically conductive lines on the substrate and electrically connected to the LED dies for electrically driving the LED dies to emit light, a grid structure over the substrate forming an array of cavities to surround the LED dies in respective cavities, an optically reflective coating at least partially covering one or more of exposed regions of the substrate, the electrically conductive lines, or surfaces of the grid structure, and optically transparent plates placed over at least some of the cavities of the grid structure allowing transmission of light produced by a respective LED die inside a respective cavity.
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