Package systems and manufacturing methods thereof
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United States of America Patent
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Aug 18, 2015
Grant Date -
Jun 19, 2014
app pub date -
Feb 5, 2014
filing date -
Oct 8, 2010
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Abstract
A method of forming a package system includes providing a first substrate having a metallic pad and at least one metallic guard ring. The method further includes bonding the metallic pad of the first substrate with a semiconductor pad of a second substrate, wherein the at least one metallic guard ring is configured to at least partially interact with the semiconductor pad to form at least a first portion of an electrical bonding material between the first and second substrates.
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