Arrangement of two substrates having an SLID bond and method for producing such an arrangement

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United States of America Patent

PATENT NO 9111787
APP PUB NO 20110233750A1
SERIAL NO

13133521

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Abstract

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An arrangement having a first and a second substrate is disclosed, wherein the two substrates are connected to one another by means of an SLID (Solid Liquid InterDiffusion) bond. The SLID bond exhibits a first metallic material and a second metallic material, wherein the SLID bond comprises the intermetallic Al/Sn-phase.

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Patent Owner(s)

Patent OwnerAddress
ROBERT BOSCH GMBH70442 STUTTGART

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Feyh, Ando Palo Alto, US 94 496
Trautmann, Achim Leonberg, DE 12 25

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