Metal heterocyclic compounds for deposition of thin films
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United States of America Patent
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Aug 18, 2015
Grant Date -
May 1, 2014
app pub date -
Jan 3, 2014
filing date -
Jun 25, 2008
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Abstract
Methods and compositions for depositing a metal containing film on a substrate are disclosed. A reactor and at least one substrate disposed in the reactor are provided. A metal containing precursor is provided and introduced into the reactor, which is maintained at a temperature of at least 100° C. A metal is deposited on to the substrate through a deposition process to form a thin film on the substrate.
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