Immobilization of Technetium by Electroless Plating
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United States of America Patent
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Aug 18, 2015
Grant Date -
Feb 27, 2014
app pub date -
Aug 12, 2013
filing date -
Aug 22, 2012
priority date (Note) -
In Force
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Abstract
A process of incorporating technetium into an electroless deposit, forming an alloy that is extremely resistant to corrosion and reduces the mobility of technetium on a geologic time scale is disclosed and claimed. The process includes providing a liquid containing technetium, such as an aqueous waste stream generated during the used nuclear fuel reprocessing activities. The technetium is collected and concentrated, and provided into an electroless deposition bath. A substrate, such as suitably prepared zero valent iron or stainless steel, is introduced into the bath to initiate autocatalytic electroless deposition of the technetium onto the substrate due to the difference in electrochemical potential between the plating bath and the metals in solution. This causes a layer of technetium metal to form on the substrate. The electroless deposition is continued until virtually all of the technetium has been removed from the bath, and then continues to build a layer of technetium-free material on the outermost surface of the substrate. One or more additional deposition steps may be performed to armor the plated substrate against leaching/corrosion in a nuclear waste disposal facility.

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- 15 United States
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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
AREVA INC | 3315 OLD FOREST ROAD LYNCHBURG VA 24501 |
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Hagerty, Kevin J | Richland, US | 1 | 1 |
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