MICROELECTRONIC PACKAGES HAVING STACKED ACCELEROMETER AND MAGNETOMETER DIE AND METHODS FOR THE PRODUCTION THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 18, 2015
Grant Date -
Sep 10, 2015
app pub date -
Mar 5, 2014
filing date -
Mar 5, 2014
priority date (Note) -
Granted
status (Latency Note)
Importance
Abstract
Methods for fabricating multi-sensor microelectronic packages and multi-sensor microelectronic packages are provided. In one embodiment, the method includes positioning a magnetometer wafer comprised of an array of non-singulated magnetometer die over an accelerometer wafer comprised of an array of non-singulated accelerometer die. The magnetometer wafer is bonded to the accelerometer wafer to produce a bonded wafer stack. The bonded wafer stack is then singulated to yield a plurality of multi-sensor microelectronic packages each including a singulated magnetometer die bonded to a singulated accelerometer die.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully