Method of forming structured-open-network polishing pads
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United States of America Patent
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Aug 18, 2015
Grant Date -
Mar 28, 2013
app pub date -
Sep 22, 2011
filing date -
Sep 22, 2011
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Abstract
The invention is a method of forming a layered-open-network polishing pad useful for polishing at least one of magnetic, semiconductor and optical substrates. Exposing a first and second polymer sheet or film of a photocurable polymer creates an exposure pattern in the first and second polymer sheet. The exposure pattern has elongated sections exposed to the energy source. The light exposure is of an exposure time sufficient to cure the photocurable polymer, but insufficient to cure adjacent elongated sections together. Attaching the first and second polymer sheets forms a polishing pad with the patterns of the first and second polymer sheets crossing. Curing the layered-open-network polishing pad to secure the layered-open-network polishing pad with the first and second sheets having sufficient stiffness to reduce sagging and maintain an orthogonal relationship between the elongated channels and the parallel planes of the polymer sheets.
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