Barrel-plating quad flat no-lead (QFN) packaging structures and method for manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 11, 2015
Grant Date -
Nov 13, 2014
app pub date -
May 6, 2014
filing date -
Nov 30, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A barrel-plating quad flat no-lead (QFN) package structure and a method for manufacturing the same. The method includes: providing a metal substrate for a plurality of QFN components; forming a first photoresist film on a top surface of the substrate; forming a plating pattern in the first photoresist film; forming a first metal layer containing a plurality of inner leads; etching the substrate from the back surface of the substrate to form a plurality of I/O pads; filling sealant in the etched areas; attaching at least one die in a predetermined region on the top surface of the substrate; connecting the die and the inner leads using metal wires; sealing the die, the inner leads, and the metal wires with a molding compound; separating the resulting joint QFN components into individual QFN components; and forming a second metal layer on the back surface of the I/O pads.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully