Micromechanical sensor with multiple spring bars

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United States of America Patent

PATENT NO 9103850
APP PUB NO 20120042728A1
SERIAL NO

13266985

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A micromechanical sensor comprising a substrate (5) and at least one mass (6) which is situated on the substrate (5) and which moves relative to the substrate (5) is used to detect motions of the sensor based on an acceleration force and/or Coriolis force which occur(s). The mass (6) and the substrate (5) and/or two masses which move toward one another are connected by at least one bending spring device (1) for a relative rotational motion. The bending spring device (1) has multiple, in particular two, spring bars (2) extending essentially parallel to one another for improving the linear spring characteristic of the bending spring device during the rotational motion, and at least one meander (3) on at least one, preferably on all, of the spring bars (2).

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Patent Owner(s)

Patent OwnerAddress
HANKING ELECTRONICS HONGKONG CO LIMITEDFLAT/RM A 12/F ZJ 300 LOCKHART ROAD WAN CHAI

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hammer, Hanno Graz-Lebring, AT 7 127

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