Semiconductor package and method for manufacturing the semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Sep 15, 2015
Grant Date -
Mar 21, 2013
app pub date -
Sep 10, 2012
filing date -
Sep 10, 2012
priority date (Note) -
Withdrawn
status (Latency Note)
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Abstract
A semiconductor package includes a first semiconductor chip including a target circuit surface and a side surface, a first sealing insulating layer including a first surface positioned toward the target circuit surface and configured to seal the target circuit surface and the side surface, at least one wiring layer formed on the first surface of the first sealing insulating layer, at least one insulating layer formed on the at least one wiring layer, a second semiconductor chip mounted on the at least one insulating layer, and a second sealing insulating layer formed on the at least one insulating layer and configured to seal the second semiconductor chip.
First Claim
Other Claims data not available
Family
| Country | kind | publication No. | Filing Date | Type | Sub-Type |
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International Classification(s)
- 2012 Application Filing Year
- H01L Class
- 20465 Applications Filed
- 18077 Patents Issued To-Date
- 88.34 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 10 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 4, 2027 |